AMAOE PD-C Planting Tin Pad Universal Magnetic BGA Reballing Platform for iPhone 6-15 Phone CPU IC Rework Adsorption Silicon Mat

Amooe CPU Reballing Platform with stencil for iPhone A8-17 Pro CPU RAM chips soldering repair. Amaoe PD-C Tin Planting Pad high-temperature resistant insulating silicone pad for mobile phone BGA CPU chips reballing soldering repair

Amaoe PD-C pad used with a magnetic positioning base and is suitable for tin implantation and welding of chips with a thickness of less than 0.9mm

Option:

1. Amaoe PD-C Tin Planting Pad only.

2. Amaoe PD-C pad with magnet base set